LTM4619
APPLICATIONS INFORMATION
Layout Checklist/Example
The high integration of LTM4619 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
? Use large PCB copper areas for high current path, includ-
ing V IN , PGND, V OUT1 and V OUT2 . It helps to minimize
the PCB conduction loss and thermal stress.
? Place high frequency ceramic input and output capaci-
tors next to the V IN , PGND and V OUT pins to minimize
high frequency noise.
? To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnections
between top layer and other power layers.
? Do not put vias directly on the pads.
? Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
? Decouple the input and output grounds to lower the
output ripple noise.
Figure 17 gives a good example of the recommended layout.
? Place a dedicated power ground layer underneath the
unit.
TOP VIEW
PGND
C IN2
M
L
K
J
H
G
F
E
D
C
B
A
V IN
C IN1
PGND
1
2
3
4
5
6
7
8
9
10
11
12
C OUT2
C OUT1
V OUT2
PGND
V OUT1
Figure 17. Recommended PCB Layout
4619fb
For more information www.linear.com/LTM4619
17
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